JTX IR-3 Thermochromic Short Circuit Finder Pad | 35°C Heat Detection
JTX IR-3 Thermochromic Short Circuit Finder Pad | 35°C Heat Detection
JTX IR-3 Thermochromic Short Circuit Finder Pad
The JTX IR-3 Thermochromic Short Circuit Finder Pad is an essential diagnostic tool for mobile phone motherboard repair technicians. Using advanced thermochromic silicone technology, this reusable pad visually reveals overheating fault points the moment the board is powered on — no thermal imager required. White spots appear precisely at locations where heat exceeds 35°C, allowing you to instantly pinpoint short circuits and faulty components with accuracy and confidence.
Made in Mainland China.
Key Features
- Instant Visual Heat Detection: Color-changing silicone pad turns white at spots exceeding 35°C, clearly marking short-circuit locations on any phone motherboard.
- Reusable & Resettable: Once the board is powered off and cooled down, the pad fully returns to its original state — ready for the next diagnostic session.
- Silicone Construction: Flexible, thin silicone material conforms easily over circuit boards, ensuring maximum contact coverage for accurate heat mapping.
- Replaces Rosin Testing & Thermal Cameras: A cost-effective alternative to expensive thermal imagers and messy rosin-based fault finding methods.
- Wide Compatibility: Works with a broad range of smartphone and tablet motherboards for professional repair use.
- Simple 4-Step Process: No special training or equipment needed — just lay, power on, locate, and reset.
How to Use
- Lay the IR-3 pad flat over the motherboard to be tested.
- Power on the motherboard — white spots will appear wherever heat exceeds 35°C due to a short circuit.
- Identify faulty components based on the exact position of the white spots.
- Power off the board and allow it to cool. The pad resets to its original state and is ready for reuse.
Specifications
| Model | JTX IR-3 |
| Activation Temperature | 35°C |
| Material | Silicone |
| Type | Thermochromic Heat Detection Pad |
| Application | Phone / Tablet Motherboard Fault Diagnosis |
| Country of Origin | Mainland China |
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Frequently Asked Questions
Q: How does the JTX IR-3 thermochromic pad detect short circuits on a phone motherboard?
A: The JTX IR-3 pad is made from thermochromic silicone that changes color from transparent to white at 35°C. When laid over a powered motherboard, any area experiencing a short circuit generates excess heat that exceeds this threshold, causing the pad to display a visible white spot directly above the fault location — making it easy to identify damaged or shorted components without specialized equipment.
Q: Is the IR-3 short circuit finder pad reusable?
A: Yes! The JTX IR-3 pad is fully reusable. Once the motherboard is powered off and the pad cools back down below 35°C, it returns to its original transparent state automatically. There is no degradation in performance between uses, making it a highly cost-effective tool for professional repair technicians.
Q: What types of devices is the IR-3 heat detection pad compatible with?
A: The IR-3 thermochromic short circuit finder pad is compatible with a wide range of smartphones and tablets. Its flexible silicone construction allows it to conform to various motherboard shapes and sizes, making it a versatile addition to any mobile device repair toolkit.
Q: Is this pad a better option than using a thermal imager or rosin for fault detection?
A: For most motherboard short circuit diagnostics, the JTX IR-3 pad offers a practical, affordable alternative. Unlike thermal imagers, it requires no power source or screen, and unlike rosin testing, it leaves no residue on the board. It provides a clear, instant visual indication of heat sources, streamlining the fault-finding process significantly.
Production & Packaging Notice
To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.